Wafer Biscuits, Waffles, Sugarcones, Wafers, Ice Cream Cone Machines, Bakery

  Features
  Technical Specifications
  Output Details
  Baking Process
  Book Cooling Machine-BC
  FAQ

BW - Series

The Fully Automatic Wafer Biscuit Oven - BW Series are best suitable or making flat wafers. These ovens supplied with 12, 18, 24, 30 and 36 sets of Baking Plates mounted lengthwise. The Baking Plates measure 230mm x 290mm.

BW Series machines are also available for production of Hollow Wafers, Logos, and Deep Patterns Choice of heating by Liquefied Petroleum Gas (LP Gas) or Electricity ensures customization to the customer's energy availability.

The oven is constructed with robust steel frame with a chain path and a continuous line chain that carries the tong carriages and baking plates.

The conveyor of the oven with baking plates moves on running wheels. We have developed low maintenance bearings and bushes as running wheels and locking rollers.

Wafer Sheet Cooling Tunnel

The Wafer Sheets Tunnel is attached with the oven. The sheet cooling tunnel will collect the wafer sheets from the oven and send the sheets one by one to the Creaming machine.

The Wafer Sheets immediately after baking will be worm and required to be cool before going to creaming.

Features



Side View	Batter Pump	Baking Plates

LP GAS HEATED OVENS

ELECTRIC HEATED OVENS

These ovens are supplied with special Gas system which equally distributes the fuel.

The ignition and safety system of the gas system monitors the combustion process. In the event of a pressure loss or a power failure, it automatically turns the heating off

These ovens are supplied with special segmental burners which provide a flame pattern that evenly flames all the baking plates, ensuring the heat distribution.

These ovens are supplied with electrical heating system. Each Baking Plate consist a heating coil.

Carbon current collectors will ensure proper and equal distribution of heat.

Technical Data

MODEL No	BW-12	BW-18	BW-24	BW-30	BW-36
Number of Baking Plates	12	18	24	30	36
Size of Baking Plates (in mm)	230x290	230x290	230x290	230x290	230x290
Output of Wafer Sheets/hour	360	540	720	900	1080
LP GAS HEATED OVEN
LP Gas Consuption / hour	4	6	8	10	12
FOR ELECTRIC HEATED OVENS
Connected Load in KW	25	40	50	60	70
Power Consumption in KW/hour	20	32	40	52	64
DIMENSIONS IN MM
Length	2500	3300	4100	4900	5700
Width	1100	1100	1100	1100	1100
Height	1500	1500	1500	1500	1500
Net Wt in Kg's (approx)	1300	1900	2500	3100	3700
Production of Cream filled Wafer Biscuits/hour	20	30	40	50	60

* Production capacity may vary based on cream ratio to wafer sheet.

Baking Process

The oven should be heated initially for about 20 - 30 minutes before starting the regular production.

All the required raw materials like Wheat Flour, Maize Starch Powder, Vegetable Fat, Preservatives etc., are to be mixed in Batter Mixing Machine to form liquid batter.

The liquid batter so mixed in Batter Mixing Machine should pour into the batter container of the oven. With the help of a CAM operated batter pump the liquid batter will be deposited into the preheated baking plates.

The Wafer Sheets can be backed according to the required heating. The baking cycle will take 1.5 to 2 minutes

NOTE: Batter Consistency, thickness of Wafer sheets, and temperature determines the baking time

Air Blower attached to the oven make easy removal of single backed wafer sheets without sticking to the baking plates.

The finished wafer sheets will automatically with the help of a conveyor attached to the oven passes through the Wafer Sheet Cooling Tunnel for cooling.

The cooled wafer sheets will feed to the Automatic Cream Spreading Machine. The Cream is applied on the wafer sheets. The wafer sheets are stacked on top of one another to form a sandwich.

The wafer books prepared require cooling, for the liquid cram to set, to obtain the necessary consistency for subsequent cutting and packing operation.

The wafer books so cooled should be cut in Automatic Cutting Machine into slices (as per the required sizes). The wafer biscuits thus prepared is now ready to be packed.

Book Cooling Machine-BC

FAQ

Question	What is the warranty period of the machine?
Answer	The warranty period is one year for the machine "excluding electrical"

Question	Is Training will be provided?
Answer	Yes, training will be provided at Hyderabad in our Factory.

Question	What is the total area required for the total operation?
Answer	You require 1200 sft built up area for the total operation

Question	What are the supporting equipment required to run the machine?
Answer	Apart from the Wafer Baking Oven, Wafer Sheet Cooling Tunnel, Batter Mixing Machine, Cream Mixing Machine, Automatic Cream Spreading Machine, Automatic Cutting Machine, and Packing Machine.

Question	Can a single machine make different sizes of the cones?
Answer	The machine can produce one single pattern of wafer sheet at one time. However you can also make Hollow Wafers, Deep Patterns, and Logos by interchanging the Baking Plates. The construction of the machine is well designed to quick changeover of the plates from one pattern to another. It will take maximum 3 to 4 hours to the change the baking plates from one pattern to another and start production.

Question	What are all the models can make with single machine?
Answer	By interchanging the moulds of the machine one can produce the following apart from the Ice Cream Cones, CUPS, STICKS, BALLS, MOLDED SUGAR CONES

Question	Is Raw materials will be available easily?
Answer	Yes all the raw materials required to produce Ice Cream Cones, Sticks, Cups, and Molded Sugar Cones are easily available in the local markets.

Question	What are the Raw Materials required?
Answer	The Main Raw Materials required are Wheat Flour, Maize Starch Power, Vegetable Fat and Food Colours etc.,