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  Technical Specifications
  Output Details
  Baking Process
  FAQ

SW - Series

The Fully Automatic Wafer Biscuit Oven - SW Series is are compact in terms of space requirement with Horizontal Banking Plates of 350 x 500 mm size.

The SW Compact Series are best suitable for making flat wafers in large scale. These overs supplied with 48 and 60 baking plates mounted lengthwise.

SW Series machines are also available for production of Hollow Wafers, Logos, and Deep Patterns.

Choice of heating by LPG or Electricity ensures customization to the customers energy availability. The oven is constructed with robust steel frame with a chain path and continuous line chain that carries the tong carriages and baking plates.

The Conveyor of the oven with baking plates moves on running wheels. We have developed low maintenance bearings and bushes as running wheels and locking rollers.

The oven is well constructed with doors on both sides, which will help easy maintenance and cleaning. Exhaust lid is attached to the oven on the top for removal the baking vapors.

The side doors of the oven are equipped with special asbestos free double insulation, which always ensures that the oven maintains the heat required for baking process.

The oven has a control panel at the front which controls the speed of the conveyor, the batter pump and ignition.

  Technical Data

MODEL No

SW - 48

SW - 60

Number of Baking Plates

45

60

Size of Baking Plates

350x500

350x500

Output of Wafer Sheets/hour

1350

1800

LP GAS HEATED OVEN
LP Gas Consuption / hour

28

35

DIMENSIONS IN mm
Length

10000

12500

Width

1400

1400

Height

2450

2450

Net Wt in Kg's (approx)

11000

13000

Production of Cream filled Wafer Biscuits/hour

185

250

* Production capacity may vary based on cream ratio to wafer sheet


 

   Baking Process


The oven should be heated initially for about 20 - 30 minutes before starting the regular production.

All the required raw materials like Wheat Flour, Maize Starch Powder, Vegetable Fat, Preservatives etc., are to be mixed in Batter Mixing Machine to form liquid batter.

The liquid batter so mixed in Batter Mixing Machine should pour into the batter container of the oven. With the help of a CAM operated batter pump the liquid batter will be deposited into the preheated baking plates.

The Wafer Sheets can be backed according to the required heating. The baking cycle will take 1.5 to 2 minutes 

NOTE: Batter Consistency, thickness of Wafer sheets, and temperature determines the baking time.

Wafer Sheet Tunnel

The Wafer Sheets Tunnel is attached with the oven. The sheet cooling tunnel will collect the wafer sheets from the oven and send the sheets one by one to the Creaming machine.

The Wafer Sheets immediately after baking will be worm and required to be cool before going to creaming.

Wafer Sheet Cooling Tunnel

The finished wafer sheets will automatically with the help of a conveyor attached to the oven passes through the Wafer Sheet Cooling Tunnel for cooling. 

Automatic Cream Spreading Machine

The cooled wafer sheets will feed to the Automatic Cream Spreading Machine. The Cream is applied on the wafer sheets. The wafer sheets are stacked on top of one another to form a sandwich. The wafer books prepared require cooling, for the liquid cram to set, to obtain the necessary consistency for subsequent cutting and packing operation. 

 

 

 

Automatic Cutting Machine

The wafer books so cooled should be cut in Automatic Cutting Machine into slices (as per the required sizes). The wafer biscuits thus prepared is now ready to be packed. 

 

  FAQ

Question What is the warranty period of the machine?
Answer The warranty period is one year for the machine "excluding electrical"
Question Is Training will be provided?
Answer Yes, training will be provided at Hyderabad in our Factory.
Question What is the total area required for the total operation?
Answer

You require 1200 sft built up area for the total operation

Question What are the supporting equipment required to run the machine?
Answer Apart from the Wafer Baking Oven, Wafer Sheet Cooling Tunnel, Batter Mixing Machine, Cream Mixing Machine, Automatic Cream Spreading Machine, Automatic Cutting Machine, and Packing Machine. 
Question Can a single machine make different sizes of the cones?
Answer The machine can produce one single pattern of wafer sheet at one time. However you can also make Hollow Wafers, Deep Patterns, and Logos by interchanging the Baking Plates. The construction of the machine is well designed to quick changeover of the plates from one pattern to another. It will take maximum 3 to 4 hours to the change the baking plates from one pattern to another and start production.
Question What are all the models can make with single machine?
Answer By interchanging the moulds of the machine one can produce the following apart from the Ice Cream Cones, CUPS, STICKS, BALLS, MOLDED SUGAR CONES
Question Is Raw materials will be available easily?
Answer Yes all the raw materials required to produce Ice Cream Cones, Sticks, Cups, and Molded Sugar Cones are easily available in the local markets.
Question What are the Raw Materials required?
Answer The Main Raw Materials required are Wheat Flour, Maize Starch Power, Vegetable Fat and Food Colours etc.,



 

Factory : Plot No: A1, Phase I , VSEZ, Duvvada, Visakhapatnam – 530 046, Andhra Pradesh, India.

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