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India's truly reliable and pioneer in the designing, manufacturing of machinery for Ice Cream Cones, Wafer Biscuits etc.,

Wafer Biscuit Machinery

 

The Wafer Biscuit Machineries are designed for the production of Flat shaped wafers. We can supply these machines from Manual operated machines to fully automatic ovens.

MANUAL WAFER BISCUIT MACHINE - MW Series

The MW Series Manual Wafer Biscuit Machines are used for low investment production of Wafer Biscuits from 6 tongs (125kg per shift of 8 hours) to 12 tongs (250kgs per shift of 8 hours). The constructions of the baking plates of the machine are well designed to adjust the thickness of the wafer sheet.

The MW Series machines are supplied with all the supporting machinery for total production line, like Batter Mixing Machine, Cream Mixing Machine, Semi Cream Spreading Machine, and Manual Wafer Cutting Machine.

These machines are heated by Electricity.

FULLY AUTOMATIC WAFER BISCUIT OVEN - BW Series

The BW Series Fully Automatic Wafer Biscuit Machines (Plate Size 230 x 290) are well suitable for medium scale production of Wafer Biscuits from 200 kgs to 400 kgs (per shift of 8 hours). These machines are supplied with 12, 18, 24, 30 and 36 plates as per the requirements of the output.

The BW Series machines are supplied with all the supporting machinery for total production line, like Batter Mixing Machine, Automatic Wafer Sheet Takeoff Device, Sheet Cooling Tunnel, Automatic Creaming Machine and Automatic Cutting Machine.

These machines can be heated by L.P. Gas or if preferred by Electricity.

FULLY AUTOMATIC WAFER BISCUIT OVEN - CW/DW Series

The CW/DW Series Fully Automatic Wafer Biscuit Machines (Plate size 290 x 460) are well suitable for large scale production of Wafer Biscuits from 400 kg's to 1000
kg's (per shift of 8 hours). These machines are supplied with 12, 18, 24, 30 and 36 plates as per the requirements of the output.

The CW/DW Series machines are supplied with all the supporting machinery for total production line, like Batter Mixing Machine, Automatic Wafer Sheet Takeoff Device, Sheet Cooling Tunnel, Automatic Creaming Machine and Automatic Cutting Machine.

These machines can be heated by L.P. Gas or if preferred by Electricity.