Features
  Technical Specifications
  Output Details
  Baking Process
  FAQ

The MW Series Cream Wafer Biscuit Machinery is very simple to operate. These machines are operated manually. 

Based on the requirement of the output these machines are supplied with 6 tongs, 9 tongs, and 12 tongs.

These machines are supplied with all the supporting machinery like Semi Cream Spreading Machine, Manual Cutting Machine, Batter Mixing Machine, Cream Mixing Machine, for total production line.

  Features

The MW Series Cream Wafer Biscuit Machinery is very simple to operate. These machines are operated manually. 

Based on the requirement of the output these machines are supplied with 6 tongs, 9 tongs, and 12 tongs.

These machines are supplied with all the supporting machinery like Semi Cream Spreading Machine, Manual Cutting Machine, Batter Mixing Machine, Cream Mixing Machine, for total production line.

  Operation

The MW Series machines are supplied with 3 sets of baking plates, screwed down and well fitted to support table. Hence one single person can operate the entire 3 sets of plates without any problem.

The machine consists of upper and bottom portion of plates, which are easily, opens and close by levers. The both upper and bottom portion of mould will consist of electrical heaters for baking. During the baking process the heat can be adjusted to the required level with electrical control panels (supplied with each set of baking plates)

Technical Data

Note :** may vary depending on the recipe, batter consistency, cream ratio etc.

MW series are used for low investment production of Wafer Biscuits from 6 tongs (125 Kg/8 hours) or 12 tongs (250 Kg/8 hours). The baking plates are made of special cast alloy and thickness of sheet is adjustable.

Two worker can operate upto 6 wafer tongs. Besides packing we require 5 workers, 700 sqm area, to produce 125 kg cream wafer Biscuits in 8 hours.

The batter is poured into preheated wafer tongs by a special feeder. The wafer sheet is backed in 2-3 minutes depending on consistency and reciepe of batter. The wafer sheets are cooled before applying cream. The creamed sheets are staced to form wafer books before being cut to required size. The Wafer Biscuits are now ready to be packed.

***3 Wafer tongs are moulted on one table, Set of 2 tables We reserve the right to change technical data illustrations.

It is a simple stenciling apparatus. The ready made Cream is poured in cream tanker (as shown in the picture) The sheet holder is designed to hold the sheet in place and the cream tanker should be pulled to allow desired cream application. You may keep another sheet on the top by adjusting the gear attached to the machine to form cream filled wafer books.

   Electrification

The required electrical connection is 240 volts, single phase, 50Hz, 1.5Kw, Total 2.5 kw

There are two electrical heating elements in each set of baking plates.

Please make sure for proper earthing for safe working   

   Baking Process

Before starting the regular production with new baking plates, the plates must be cleaned and greased well with hard vegetable fat, which ensures proper release of wafer sheet without sticking to the baking plates. 

The initial heating will take about 15 - 20 minutes before starting regular production. The Baking plates of the machines should be in closed condition during the initial heating period. You may set the thermostat of the control panel to 70 to 80 after reaching the required temperature.

The Liquid dough prepared by the Batter Mixing machine should put into the Batter Container (supplied with the machine), before starting the production activity. Now dip the Feeding Device (supplied with the machine) in to the dough, and make sure that each small cup of the Feeding Device contains the same quantity of the dough. 

Note: The Feeding Device is well designed with small cups, which will transfer the same quantity of the dough required for baking Wafer sheet. The sizes of the cups will vary depending on the thickness of the wafer sheet and its design.

The Feeding Device filled with the Liquid Batter should keep on the surface of the lower portion of the baking plate, and the lever of the Feeding Device should be pulled to the front. Now the Liquid Batter is spread on the lower portion of baking plate. Please remove the Feeding Device from the surface of the lower baking plate and dip into the Batter Container to fill with the liquid dough again for next set of Baking Plates.

Now close the upper portion of the baking plate gently and lock to the lower portion of baking plate

Note: The handle connected to the upper portion of the Baking Plates is designed to lock to the lower portion of the baking plate when it is closed.

Immediately after closing the upper portion of the baking plate a little excess material will come out of 4 corners of the Baking Plates with sound in order to obtain water vaporization as well as perfect finish of the Wafer Sheet.

Special Note: When baking for the first time please put a little quantity of the liquid batter, and increases the quantity till you can have proper wafer sheet. One or two wafer sheets may go bad, when you are baking for the first time due to lower heat.

Baking time will take 2 minutes approximately. (Batter consistency, thickness of the wafer sheet, working speed, and baking temperature determines the baking time). After Baking time, please open the upper portion of the baking plate gently. 

Your Wafer sheet is ready and can be removed with the help of a wooden knife.

Cleaning and Maintenance

When the baking plates are in use for longer time some burnt sugar and fat particles leave a brown crust on the surface of the baking plates, which is to be removed from time to time. Otherwise carbon may develop on the baking plates. Please use brass wire brush for cleaning the baking plates.

Always instruct the operator to use side handle to lower and close the upper baking plate.

Please do not use much force while closing the upper baking plate.


NOTE: Batter Consistency, thickness of Wafer sheets, and temperature determines the baking time 

Air Blower attached to the oven make easy removal of single backed wafer sheets without sticking to the baking plates. 

The finished wafer sheets will automatically with the help of a conveyor attached to the oven passes through the Wafer Sheet Cooling Tunnel for cooling.

The cooled wafer sheets will feed to the Automatic Cream Spreading Machine. The Cream is applied on the wafer sheets. The wafer sheets are stacked on top of one another to form a sandwich. 

The wafer books prepared require cooling, for the liquid cram to set, to obtain the necessary consistency for subsequent cutting and packing operation.

The wafer books so cooled should be cut in Automatic Cutting Machine into slices (as per the required sizes). The wafer biscuits thus prepared is now ready to be packed.

  FAQ